就爱字典>英语词典>dicing翻译和用法

dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

  • 骰子;色子
    Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
    1. 掷骰子游戏
      Diceis a game which is played using dice.
      1. VERB 把(食物)切成小块;将…切丁
        If youdicefood, you cut it into small cubes.
        1. Dice the onion...
          把洋葱切成丁。
        2. Add the crushed garlic and remaining diced vegetables.
          加入捣碎的大蒜和剩余的蔬菜丁。

      双语例句

      • The system functions mainly include macro dicing, micro planning and district demolition.
        该系统主要有学校宏观划片、微观规划和片区拆迁等功能。
      • We are dicing for drinks. It's foolish to risk money on a throw of the dice.
        我们在掷骰子赌喝酒。掷骰子赌博,是很愚蠢的。
      • Dicing area can be washed by water directly and easily be cleaned up.
        切菜区域可直接用水冲刷,清洗方便。
      • A multiple beam, sub surface laser dicing technology is currently being developed, which will improve the productivity of such a process significantly.
        多光束内部激光划片技术正在开发中,它将显著提高产量。
      • Design and Realization of CAN node for Full Automatic Dicing Saw
        全自动划片机中CAN总线节点设计与实现
      • A lady doesn't crawl around on the decks dicing with the crew.
        高贵女士可不会和船员们在船的甲板上来回爬。
      • Just like tags for requirements, categories of your test cases can be invaluable for slicing and dicing your testing data so that you can determine what's really happening.
        就像对于需求的标签一样,测试用例的范畴对于切割测试数据以便决定到底发生了什么来说是无价的。
      • Design and Implementation of Primary and Secondary Schools Admission Dicing System Based on Proximity Principle
        基于就近原则的中小学招生划片系统设计与实现
      • You're dicing with death by driving that car so fast.
        你把车开得那么快简直在找死。
      • After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
        通过对半导体加工工艺的分析研究,提出了用磨料水射流切割半导体材料,包括晶圆的切割、芯片的终端封装切割。